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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays. 1/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 max 108 segments (seg27com4) standard lcd segment drivers bu9795afv-lb this is the product guarantees long time support in industrial market. features ? long time support product for industrial applications. ? integrated ram for display data (ddram) : 35 4bit ? lcd drive output : 4 common output, 27segment output ? integrated buffer amp for lcd driving ? integrated oscillator circuit ? no external components ? low power consumption design applications ? industrial equipment ? telephone ? fax ? portable equipment (pos, ecr, pda etc.) ? dsc ? dvc ? car audio ? home electrical appliance ? meter equipment etc. key specifications supply voltage range: +2.5v to +5.5v operating temperature range: -40c to +85c max segments:bu9795afv-lb 108 segments display duty: 1/4 bias: 1/2, 1/3 selectable interface: 3wire serial interface package w (typ.) x d (typ.) x h (max.) typical application circuit figure 1. typical application circuit controller vddvlcd inhb csb sd scl oscin test vss com0com1 com2 com3 seg4seg5 segment lcd vdd seg30 ???? ??? internal oscill ator circuit mode ssop-b40 13.60mm x 7.80mm x 2.00mm downloaded from: http:///
datasheet datasheet 2/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) block diagrams / pin configurations / pin descriptions bu9795afv-lb figure 2. block diagram figure 3. pin configuration (top view) table 1 pin description pin name pin no. i/o function inhb 36 i input terminal for turn off display h : turn on display l : turn off display test 35 i test input (rohm use only) must be connected to vss oscin 31 i external clock input ext. clock and int. clock can be changed by command. must be connected to vss when using internal oscillation circuit. sd 34 i serial data input scl 33 i serial data transfer clock csb 32 i chip select : l active vss 30 gnd vdd 29 power supply vlcd 28 i power supply for lcd driving seg4 to 30 1 to 23, 37 to 40 o segment output for lcd driving com0 to 3 24 to 27 o common output for lcd driving lcd bias selector common driver segment driver oscillator power on reset sd scl vlcd oscin vss com0 com3 seg4 seg30 if filter serial inter face command register common counter ddram lcd voltage generator command data decoder blink timing generator vdd csb test inhb seg22 seg21 seg17 seg20 seg16 seg23 seg19 seg10 seg8 seg9 seg11 seg12 seg13 seg14 seg15 seg18 seg26 seg25 seg24 seg27 scl sda seg5 test seg6 csb inhb seg30 seg28 seg29 com0 com2 com3 seg7 seg4 vdd vss oscin vlcd com1 downloaded from: http:///
datasheet datasheet 3/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) absolute maximum ratings (vss=0v) parameter symbol ratings unit remark power supply voltage1 vdd -0.5 to +7.0 v power supply power supply voltage2 vlcd -0.5 to vdd v lcd drive voltage power dissipation pd 0.7 w when use more than ta=25 c, subtract 7mw per degree (bu9795afv-lb) (package only) input voltage range vin -0.5 to vdd+0.5 v operational temperature range topr -40 to +85 c storage temperature range tstg -55 to +125 c caution :operating the ic over the absolute maximum ratings may damage the ic.the damage can either be a short circui between pins or a n open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=-40c to +85c, vss=0v) parameter symbol ratings unit remark min typ max power supply voltage1 vdd 2.5 - 5.5 v power supply power supply voltage2 vlcd 0 - vdd -2.4 v lcd drive voltage (note) please use vdd-vlcd 2.4v condition. electrical characteristics dc characteristics (vdd=2.5v to 5.5v, vss=0v, ta=-40c to +85c, unless otherwise specified) parameter symbol limits unit conditions min typ max h level input voltage vih 0.7vdd - vdd v l level input voltage vil vss - 0.3vdd v h level input current iih - - 1 a l level input current iil -1 - - a lcd driver on resistance seg ron - 3.5 - k ? iload=10a com ron - 3.5 - k ? vlcd supply voltage vlcd 0 - vdd -2.4 v vdd-vlcd 2.4v standby current ist - - 5 a display off, oscillator off power consumption1 idd1 - 12.5 30 a vdd=3.3v, ta=25c, power save mode1, fr=70hz 1/3 bias, frame inverse power consumption2 idd2 - 20 40 a vdd=3.3v, ta=25c, normal mode, fr=80hz 1/3 bias, line inverse downloaded from: http:///
datasheet datasheet 4/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) electrical characteristics - continued oscillation characteristics (vdd=2.5v to 5.5v, vss=0v, ta=-40c to +85c) parameter symbol limits unit conditions min typ max frame frequency f clk 56 80 104 hz fr = 80hz setting frame frequency1 f clk1 70 80 90 hz vdd=3.5v, 25 c mpu interface characteristics (vdd=2.5v to 5.5v, vss=0v, ta=-40c to +85c) parameter symbol limits unit conditions min typ max input rise time tr - - 80 ns input fall time tf - - 80 ns scl cycle time tscyc 400 - - ns h scl pulse width tshw 100 - - ns l scl pulse width tslw 100 - - ns sd setup time tsds 20 - - ns sd hold time tsdh 50 - - ns csb setup time tcss 50 - - ns csb hold time tcsh 50 - - ns h csb pulse width tchw 50 - - ns figure 4. interface timing i/o equivalence circuit figure 5. i/o equivalence circuit csbscl sd tcsh tscyc tslw tshw tsds tsdh tf tr tcss vdd vlcd vss vdd inhb vss vdd test vss vdd oscin vss vdd vss vdd csb, sd, scl vss vlcd seg4-30 com0-3 vss downloaded from: http:///
datasheet datasheet 5/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) example of recommended circuit using internal oscillator circuit mode using external oscillator mode figure 6. bu9795afv example recommended circuit controller vddvlcd inhb csb sd scl oscin test vss com0com1 com2 com3 seg4 seg5 se g ment lcd vdd seg30 ? ? ? ? ? ? controlle r vddvlcd inhb csb sd scl oscin test vss com0com1 com2 com3 seg4 seg5 segment lcd vdd seg30 ? ? ? ? ? ? downloaded from: http:///
datasheet datasheet 6/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) function description command and data transfer method 3-spi (3wire serial interface) this device is controlled by 3-wire signal (csb, scl, and sd). first, interface counter is initialized with cs b=h", and csb=l makes sd and scl input enable. the protocol of 3-spi transfer is as follows. each command starts with command or data judgment bi t (d/c) as msb data, followed by d6 to d0 during csb =l. (internal data is latched at the rising edge of scl, it is converted to 8bits parallel data at the falling edge of 8th clk.) d/c = h : command d/c = l : data figure 7. 3-spi command/data transfer format command transfer method after csb=h l, 1st byte is always a command input. msb of the command input data will be judge d that the next byte data, it is a command or display data (this bit is called command or data judgment bit). when set command or data judge bit=1, next byte will be (continuously) command. when set command or data judge bit=0, next byte data is display data. once it becomes display data transfer condition, it will no t be back to command input condition even if d/c=1. so if you want to send command data again, please set csb=l h. (csb l h will cancel data transfer condition.) command transfer is done by 8bits unit, so if csb=l h with less than 8bits data transfer, command will be cancelled. it will be able to transfer command with csb=l again. figure 8. command transfer format 1 command 1 command 1 command 0 command display data command command/data d5 scl csb sd d2 d1 d0 d7 d/c d6 d5 d4 d3 d2 d1 d0 d/c d1 d0 d7 d6 d6 d5 d4 d3 d6 d5 d4 d3 d2 command command disctl command transfer command cancelled (less than 8bits) dispon command transfe r in case of command transfe r sd 1234567 6 12345 1 status 8 78 67 csbscl 8 12345 downloaded from: http:///
datasheet datasheet 7/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) write display data and transfer method this lsi has display data ram (ddram) of 274=108bit. as seg0, seg1, seg2, seg3, seg31, seg32, seg33, seg34 ar e not output, these address will be dummy address. the relationship between data input and display data, ddram data and address are as follows. 0000000 a b c d e f g h i j k l m n o p q r s t u v x y display data command dummy data 8 bit data will be stored in ddram. the address to be wri tten is the address specifie d by adset command, and the address is automatically incr emented in every 4bit data. data can be continuously written in ddram by transmitting data continuously. (when ram data is written successively after writing ram data to 22h (seg34), the address is returned to 00h (seg0) by the auto-increment function. ddram address 00h 01h 02h 03h 04h 05h 06h 07h ????? ?? 1eh 1fh 20h 21h 22h bit 0 a e i m q u c o m 0 1 b f j n r v c o m 1 2 c g k o s x c o m 2 3 d h l p t y c o m 3 seg0 seg1 seg2 seg3 seg4 seg5 seg6 seg7 ??????? seg30 seg31 seg32 seg33 seg34 as data transfer to ddram happens every 4bit data, it will be cancelled if it changes csb=l h before 4bits data transfer. figure 9. bu9795afv-lb data transfer format dummy data dummy data d3 d2 d1 return to address "0" by automatically increment. a ddress00h ram write d4 d6 internal signal d5 ram write d0 d6 d5 d0 d7 d6 write data will be canceled, when csb='h' without 4bit data transfer. d4 d3 d2 d1 d0 internal signal ram write a ddress00h a ddress01h command csb scl d7 sd a ddress se t scl csb sd d2 a ddress se t d3 d7 command ram write d1 d6 d5 d4 d0 d7 a ddress02h a ddress00h a ddress21h a ddress22h ram write (every 4bit data) d5 d4 d3 d2 d1 downloaded from: http:///
datasheet datasheet 8/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) oscillator there are two kinds of clock for logic and analog circuit; from in ternal oscillator circuit or external clock input. if interna l oscillator circuit will be used, oscin must be connected to vss. (note) when you use external clock, execute icset command and connect oscin to external clock. figure 10. internal oscillator circuit mode figure 11. external clock mode lcd driver bias circuit this lsi generates lcd driving voltage with on-chip buffer amp. and it can drive lcd at low power consumption. 1/3 and 1/2bias can be set in modeset command. line and frame inversion can be set in disctl command. refer to lcd driving waveform about each lcd driving waveform. blink timing generator this device has blinking function. this lsi is able to set blink mode with blkctl command. blink frequency varies widely by characteristic of fclk, when internal oscillation circuit. refer to oscillation characterist ics for more details on fclk. reset (initial) condition initial condition afte r execute software reset is as follows. ? display is off. ? ddram address is initialized (ddram data is not initialized). refer to command description about initialize value of register. command / function list description list of command / function no. command function 1 mode set (modeset) set lcd drive mode 2 address set (adset) set lcd display mode 1 3 display control (disctl) set lcd display mode 2 4 set ic operation (icset) set ic operation 5 blink control (blkctl) set blink mode 6 all pixel control (apctl) set pixel condition oscin bu9795afv-lb vss oscin bu9795afv-lb vss clock input downloaded from: http:///
datasheet datasheet 9/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) detailed command description d7 (msb) is bit for command or data judgment. refer to command and data transfer method. c : 0 : next byte is ram write data. c : 1 : next byte is command. (1) mode set (mode set) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 1 0 * p3 p2 * * (* : dont care) set display on and off setting p3 reset initialize condition display off(dispoff) 0 display on(dispon) 1 display off : regardless of ddram data, all segment and common output will be st opped after 1 frame of data write. display off mode will be finished by display on. display on : segment and common output will be active and start to read the display data from ddram. (note) it is not synchronize with display frame, when it will be controlled display on/off with inhb terminal. set bias level setting p2 reset initialize condition 1/3 bias 0 1/2 bias 1 refer to lcd driving waveform. (2) address set (adset) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 0 0 p4 p3 p2 p1 p0 address data is specified in p [4:0] and p2 (icset command) as follows. msb lsb internal register address [5] address [4] ??? address [0] bit of each command icset [p2] adset [p4] ??? adset [p0] the address is 00h in reset condition. the valid address is 00h to 22h. another address is invalid, (otherwise address will be set to 00h.) p2 of icset command is only to define either msb of address is 1 or 0. address counter will be set only when adset command is executed. downloaded from: http:///
datasheet datasheet 10/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) figure 12. address set sequence csb command ??? internal signal icset p2 internal signal address set address by adset command. p2 (icset command) is refer to set address. because of no setting adset command, a ddress will be set "000010", because p2 (icset)="0". it will be kept the previous address. it will be start to write ram data from maintained address. when ram data is continuously transmitted, address will be increment automatically. when write at 22h address, address will be the followi ng address that write at the end is maintained. return to 00h automatically. csb command ??? internal signal icset p2 internal signal address set address by adset command. p2(icset command) is refer to set addre ss. new address will be set by adset command. a ddress will be set "011111", because p2(icset)="0". when ram data is continuously transmitted, the following address that write at the end is maintained. address will be increment automatically. when write at 22h address, address will be return to 00h automatically. csb command ??? internal signal icset p2 internal signal address set address by adset command. p2(icset command) is refer to set address. new address will be set by adset command. a ddress will be set "100000", because p2(icset)="1". a ddress will be set "100000", because p2(icset)="1". (p2(icset) will maintain the previous address until icset command input. it will be set p2="1" by icset command. when ram data is continuously transmitted, (icset command cannot set address) address will be increment automatically. the following address that write at the end is maintained. when write at 22h address, address will be return to 00h automatically. csb command ??? internal signal icset p2 internal signal address set address by adset command. it is written to ram continuously p2(icset command) is refer to set address. from the previous address. the address maintain the previous address when ram data is continuously transmitted, because it doesn't input the adset command address will be increment automatica lly. though icset p2="0" setting. when write at 22h address, address will be return to 00h automatically. the following address that write at the end is maintained. 000101 ram write ram write ????? ram write 000011 000100 disctl ram write 100010 000000 000001 000010 a dset00010 ram write ram write 000011 000100 ram write a dset 11111 ram write ram write ram write ????? 000010 ram write 100000 100001 100010 000000 icset p2=1 a dset 00000 ram write ram write 000010 000011 ????? ram write 000001 100010 000000 100000 100001 000001 000010 000011 100000 100001 100010 000000 icset p2=1 a dset 00000 ram write ram write ????? ram write icset p2=0 ram write ram write 100000 100001 100010 000000 100010 100000 100001 a dset00000 ram write 000011 000001 ram write 000000 011111 ram write adset00000 000010 ??? ram write ram write ram write ram write 000000 000001 ????? downloaded from: http:///
datasheet datasheet 11/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) (3) display control (disctl) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 0 1 p4 p3 p2 p1 p0 set frame frequency setting p4 p3 reset initialize condition 80hz 0 0 71hz 0 1 64hz 1 0 53hz 1 1 (note) about the characteristics of fr, refer to oscillation characteristics. set lcd drive waveform setting p2 reset initialize condition line inversion 0 frame inversion 1 set power save mode setting p1 p0 reset initialize condition power save mode 1 0 0 power save mode 2 0 1 normal mode 1 0 high power mode 1 1 (note) vdd-vlcd 3.0v is required for high power mode. (reference current consumption data) setting reset initialize condition power save mode 1 0.5 power save mode 2 0.67 normal mode 1.0 high power mode 1.8 (note) above current consumption data is reference value. it depends on panel load. (note) frame frequency / lcd drive waveform / power save mode setting will affect display image. select the best value in point of current consumpti on and display image using lcd panel (under real application). mode screen flicker display image / contrast frame frequency - lcd drive waveform power save mode - downloaded from: http:///
datasheet datasheet 12/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) (4) set ic operation (icset) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 1 1 0 1 p2 p1 p0 p2: msb data of ddram address. please refer to adset command. setting p2 reset initialize condition address msb0 0 address msb1 1 set software reset condition setting p1 no operation 0 software reset 1 when software reset is executed, this lsi will be reset to initial condition. if software reset is executed, the value of p2 and p1 will be ignored and they will be set initialized condition. (refer to reset initial condition) switch between internal clock and external clock. setting p0 reset initialize condition internal clock 0 external clock input 1 for internal clock : oscin is connected to vss. for external clock input: input external clock into oscin. disctl 80hz select: frame frequency [hz] = external clock [hz] / 512 disctl 71hz select: frame frequency [hz] = external clock [hz] / 576 disctl 64hz select: frame frequency [hz] = external clock [hz] / 648 disctl 53hz select: frame frequency [hz] = external clock [hz] / 768 command icset oscin_en (internal signal) internal clock mode external clock mode (internal signal) external clock (oscin) internal oscillation figure 13. oscmode switching timing downloaded from: http:///
datasheet datasheet 13/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) (5) blink control (blkctl) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 1 1 1 0 * p1 p0 set blink condition setting (hz) p1 p0 reset initialize condition off 0 0 0.5 0 1 1 1 0 2 1 1 (6) all pixel control (apctl) msb lsb d7 d6 d5 d4 d3 d2 d1 d0 c 1 1 1 1 1 p1 p0 all display set on. off setting p1 reset initialize condition normal 0 all pixel on 1 setting p0 reset initialize condition normal 0 all pixel off 1 all pixels on: all pixels are on regardless of ddram data. all pixels off: all pixels ar e off regardless of ddram data. (note) all pixels on/off is effective only at the time of display on status. the data of ddram do not change with this comman d. if both p1 and p0=1, apoff is selected. apoff has higher priority than apon. downloaded from: http:///
datasheet datasheet 14/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) lcd driving waveform (1/3bias) line inversion frame inversion figure 14. line inversion waveform (1/3bias) figure 15. frame inversion waveform (1/3bias) o o o o s s s s o s o s s s o s s o o o o o o o s s s s o s o s o o o o s s s s downloaded from: http:///
datasheet datasheet 15/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) (1/2bias) line inversion frame inversion figure 16. line inversion waveform (1/2bias) figure 17. frame inversion waveform (1/2bias) o s o s o o o o s s s s s s s s o o o o o s o s o o o s s o s s s s s s o o o o downloaded from: http:///
datasheet datasheet 16/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) example of display data if lcd layout pattern is shown as in figure18, figure19 and ddram data is shown as in table 2, display pattern will be shown as in figure 20. c o m1 c o m2 c o m3 c o m0 figure 18. example com line pattern figure 19. example seg line pattern figure 20. example display pattern table 2. ddram data map s e g 0 s e g 1 se g 2 s e g 3 s e g 4 s e g 5 se g 6 se g 7 se g 8 se g 9 se g 10 se g 11 se g 12 se g 13 s e g 14 s e g 15 s e g 16 s e g 17 se g 18 se g 19 com0 d0 0 1 1 0 1 1 1 1 0 1 0 0 0 0 0 0 0 0 0 0 com1 d1 0 0 1 1 1 0 0 1 1 1 1 0 0 0 0 0 0 0 0 0 com2 d2 0 0 0 1 0 1 0 0 1 0 1 0 0 0 0 0 0 0 0 0 com3 d3 0 0 1 1 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0ah 0bh 0ch 0dh 0eh 0fh 10h 11h 12h 13h seg1 seg 2 seg 3 seg4 seg5 seg 6 seg 7 seg8 seg 9 seg10 downloaded from: http:///
datasheet datasheet 17/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) initialize sequence please follow sequence below after power-on to set this device to initial condition. power on csb h i/f initialize condition csb l i/f data transfer start execute software reset by sending icset command (note) each register value and ddram address, ddram data are random condition after power on till initialize sequence is execut ed. start sequence 1. start sequence example 1 no. input d7 d6 d5 d4 d3 d2 d1 d0 descriptions 1 power on vdd=0 to 5v (tr=0.1ms) 2 wait 100us initialize ic 3 csb h initialize i/f data 4 csb l i/f data transfer start 5 icset 1 1 1 0 1 * 1 0 software reset 6 blkctl 1 1 1 1 0 * 0 1 7 d i s c t l 1 0 100110 8 i c s e t 1 1 101000 r a m address msb set 9 a d s e t 0 0 000000 r a m address set 10 display data * * * * * * * * address 00h to 01h display data * * * * * * * * address 02h to 03h display data * * * * * * * * address 22h to 00h 11 csb h i/f data transfer stop 12 csb l i/f data transfer start 13 modeset 1 1 0 * 1 0 * * display on 14 csb h i/f data transfer stop downloaded from: http:///
datasheet datasheet 18/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) 2. start sequence example 2 initialize sequence dispon sequence ram write sequence dispoff sequence this lsi is initialized with initialize sequenc e. and start to display with dispon sequence. this lsi will update display data with ram write sequence. a nd stop the display with dispoff sequence. if you want to restart to display, this lsi will restart to display with dispon sequence. initialize sequence d7 d6 d5 d4 d3 d2 d1 d0 ic initialized i/f initialized icset 11101010 software reset modeset 11000000 display off a dset 00000000 ram address set display data * * ** * * * * display data dispon sequence d7 d6 d5 d4 d3 d2 d1 d0 disctl 10111111 display control blkctl 11110000 blkctl a pctl 11111100 a pctl modeset 11001000 display on ram write sequence d7 d6 d5 d4 d3 d2 d1 d0 disctl 10111111 display control blkctl 11110000 blkctl a pctl 11111100 a pctl modeset 11001000 display on a dset 00000000 ram address set display data * * ** * * * * display data dispoff sequence d7 d6 d5 d4 d3 d2 d1 d0 modeset 11000000 display off csb 'h' input data description csb 'l' description csb 'l' csb 'h' csb 'l' csb 'h' input data csb 'h' input data description wait 100us csb 'h' csb 'l' input data description power on initialize ram write dispoff dispon downloaded from: http:///
datasheet datasheet 19/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) example of start sequence start please select frame rate from 80hz, 71hz, 64hz and 53hz according to lcd panel characteristic. line inversion. power save mode= high power mode operating current display qualit y reduce operating current or enhance display quality disctl setup value "101**011" operating current decreases in order o f 80hz > 71hz > 64hz > 53hz. frame inversion. power save mode= power save mode1 disctl setup value "101**100" screen flicker? o k ng disctl setup value "101**101" disctl setup value "101**100" screen flicker? o k ng disctl setup value "101**101" disctl setup value "101**110" screen flicker? ok ng disctl setup value "101**110" disctl setup value "101**111" please select frame rate from 80hz, 71hz, 64hz and 53hz according to lcd panel characteristic. frame inversion. power save mode= power save mode1 operating current decreases in order o f 80hz > 71hz > 64hz > 53hz. frame inversion. power save mode= power save mode2 please select frame rate from 80hz, 71hz, 64hz and 53hz according to lcd panel characteristic. frame inversion. power save mode= power save mode2 operating current decreases in order o f 80hz > 71hz > 64hz > 53hz. frame inversion. power save mode= normal mode please select frame rate from 80hz, 71hz, 64hz and 53hz according to lcd panel characteristic. frame inversion. power save mode= normal mode operating current decreases in order o f 80hz > 71hz > 64hz > 53hz. frame inversion. power save mode= high power mode downloaded from: http:///
datasheet datasheet 20/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) cautions on power on condition this lsi has p.o.r (power-on reset) circuit and software reset function. please keep the following recommended power-on conditions in order to power up properly. please set power up conditions to meet the recommended tr, tf, toff, and vbot spec below in order to ensure p.o.r operation. recommended condition of tr,tf,toff and vbot figure 21. power on/off waveform if it is difficult to meet above conditions, ex ecute the following sequence after power-on. command input is not accepted during power off. it has to take ca re that software reset is not a perfect substitute to por function. (1) csb=l h condition vdd csb figure 22. csb timing (2) after csbh l, execute software reset (icset command). tr tf toff vbot less than 1ms less than 1ms more than 150ms less than 0.1v vdd tf tr toff vbot downloaded from: http:///
datasheet datasheet 21/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) cautions on application in case, bu9795afv-lb used at vlcd vss, voltage gap occur between seg line to com1C3 line at display off state. because of this voltage gap, there is possibility to display lcd for a moment. to avoid this phenomenon, please decide vdd and vlcd level to satisfy voff voltage lower than off level (off level = 1v at the example explained below). vdd=5.0v vlcd=2.0v 1/3bias ddram data all "h" vdd (5v) vlcd (2v) vlcd-vss=2v vss vdd (5v) vlcd (2v) vlcd-vss=2v vss vdd (5v) vlcd (2v) vlcd-vss=2v vss 3v2v 1v 0v -1v -2v -3v 3v2v 1v 0v -1v -2v -3v 1frame com0 output com1 output seg0 output voltage gap of com0-seg0 display on display off voltage gap of com1-seg0 display on display off send "display off" command the volatage between com0 to seg0 is 0v at display off. o s y s y y o y o o ss y o o y s ss ss s o y y voff on level off level o y oy o the volatage between com1 to seg0 is -2v at display off. downloaded from: http:///
datasheet datasheet 22/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
datasheet datasheet 23/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) operational notes C continued 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric field from th e outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevit ably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which c ause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in pr eventing damage due to sudden and unexpecte d incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. downloaded from: http:///
datasheet datasheet 24/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) ordering information b u 9 7 9 5 a f v - l b e 2 part number package product class lb for industrial applications packaging and forming specification e2: embossed tape and reel (ssop-b40) fv : ssop-b40 marking diagram ssop-b40 (top view) bu9795afv part number marking lot number 1pin mark downloaded from: http:///
datasheet datasheet 25/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) physical dimension tape and reel information package name ssop-b40 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin (max 13.95 (include. burr) downloaded from: http:///
datasheet datasheet 26/26 tsz02201-0p4p0d300510-1-2 26.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 bu9795afv-lb max 108 segments (seg27com4) revision history date revision changes 23.aug.2013 001 new release 26.feb.2014 002 delete sentence and log life cycle in general description and futures. applied new style (change of the size of the title). downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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